Our trained QC engineers use a state of the art, multi-step inspection detection processes to identify counterfeit and cloned products. The process begins with analyzing the shipping and packaging. It continues with the parts undergoing several levels of inspection including: marking and dimension checks, internal visual analysis, material analysis and electrical testing to insure the safety of the production.

• 　　Inspection of external and internal packing
• 　　Inspection of part number, date code, package, quantity  
• 　　Label comparison with picture database
• 　　IC marking comparison with picture database
• 　　Measuring of the physical dimensions of the component
• 　　Inspection of the condition of the pins or balls for the component
•         Inspection of the inside bond arrangement of the die via X-Ray
•      Ship the parts to test lab to perforum the Level 2(Visual inspection test decapsulation) and Level 3(Electronic Functional test) based on our customer reqirement.