| Manufacturer | NXP Semiconductors |
| Manufacturer Standard Lead Time | 52 Weeks |
| Series | MPC57xx |
| Package | Tray |
| Description | IC MCU 32BIT 8MB FLASH 516MAPBGA |
| Product Status | Active |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 516-BGA |
| Supplier Device Package | 516-MAPBGA (27×27) |
| Base Product Number | SPC5777 |
The NXP Semiconductors SPC5777CDK3MMO3 is a microcontroller development kit designed for the SPC5777C series of automotive microcontrollers. It provides a platform for developers to evaluate and prototype applications based on the SPC5777C microcontroller.
Key features of the SPC5777CDK3MMO3
Microcontroller: The kit is centered around the SPC5777C microcontroller, which is part of NXP’s Power Architecture family. This microcontroller is specifically designed for automotive applications, offering high performance and reliability.
Development Tools: The kit comes with development tools, which may include an integrated development environment (IDE), debuggers, and other software tools to aid in the programming and testing of applications.
Connectivity: It likely includes various connectivity options for interfacing with other devices and systems, such as USB ports, CAN (Controller Area Network) interfaces, and more.
Peripherals: The kit may feature various peripherals like GPIO (General Purpose Input/Output), timers, communication interfaces, and analog components, allowing developers to explore different application scenarios.