| Manufacturer | Intel / Altera |
| Series | Arria II GX |
| Package | Tray |
| Description | IC FPGA 156 I/O 358UBGA |
| Product Status | Active |
| Manufacturer Standard Lead Time | 30 Weeks |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 358-LFBGA, FCBGA |
| Supplier Device Package | 358-UBGA, FCBGA (17×17) |
| Base Product Number | EP2AGX45 |
- The FPGA is encapsulated in a 358-ball UBGA (Ultra Ball Grid Array) package. BGA packages offer a high pin density in a compact form factor, facilitating efficient routing of signals and contributing to space-saving designs.
- Being a field-programmable device, the EP2AGX45 allows users to configure its internal logic elements and interconnections to implement custom digital circuits. This programmability provides flexibility for prototyping, testing, and adapting designs to changing requirements.
- FPGAs like the EP2AGX45 are widely used in various applications, including telecommunications, networking equipment, industrial automation, signal processing, and more. They are particularly beneficial for applications that require high-speed digital signal processing and parallel computation.
- FPGAs are known for their integration capabilities, allowing designers to consolidate multiple functions into a single chip. This integration can lead to reduced component count, board space, and overall system complexity.